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Business Facilities
Singapore STATS ChipPAC Semiconductor Packaging Plant 3
Technical Proposal (Basic), BIM
Constractors
Hyundai Engineering
Tampines Wafer Fab Park, Singapore
Site location
148,753㎡
Total floor area
Production (B1 ~ 4F), Utility (B1 ~ 4F), Warehouse (4F), Office (6F), Parking (4F), Power Supply (3F), Substation (2F), Bin Center (1F), Guard House (1F)
Project Scale
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